ID: 13665
Kingston HyperX Predator 8GB (2 x 4 GB) - 2666 MHz
€100,00
No offers posted.
Description
Ik doe het weg wegens overbodig.
De garatiebon zit er ook bij.
SPECIFICATIONS
CL(IDD) :11 cycles
Row Cycle Time (tRCmin) : 48.125ns (min.)
Refresh to Active/Refresh Command Time (tRFCmin) : 260ns (min.)
Row Active Time (tRASmin) : 35ns (min.)
Maximum Operating Power : 2.160 W* (per module)
UL Rating : 94 V - 0
Operating Temperature : 0C to 85C
Storage Temperature : -55C to +100C
DESCRIPTION
Kingston's KHX26C11T2K2/8X is a kit of two 512M x 64-bit (4GB) DDR3-2666 CL11 SDRAM (Synchronous DRAM), 1Rx8 memory modules, based on eight 512M x 8-bit FBGA compo- nents per module. Each module kit supports Intel® XMP (Extreme Memory Profiles). Total kit capacity is 8GB. Each module kit has been tested to run at DDR3-2666 at a low latency timing of 11-13-13 at 1.65V. The SPDs are pro- grammed to JEDEC standard latency DDR3-1600 timing of 11-11-11 at 1.5V. Each 240-pin DIMM uses gold contact fingers. The JEDEC standard electrical and mechanical specifi- cations are as follows:
XMP TIMING PARAMETERS
JEDEC: DDR3-1600 CL11-11-11 @1.5V
XMPProfile#1:D3-2666CL11-13-13@1.65V
XMPProfile#2:D3-2400CL11-13-13@1.65V
FEATURES
JEDECstandard1.5V(1.425V~1.575V)PowerSupply VDDQ=1.5V(1.425V~1.575V)
800MHzfCKfor1600Mb/sec/pin
8 independent internal bank
ProgrammableCASLatency:11,10,9,8,7,6
ProgrammableAdditiveLatency:0,CL-2,orCL-1clock 8-bit pre-fetch
Burst Length: 8 (Interleave without any limit, sequential with starting address 000 only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
Bi-directional Differential Data Strobe
Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
OnDieTerminationusingODTpin
Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C
Asynchronous Reset
PCB : Height 2.122 (53.90mm) w/ heatsink, single sided component
De garatiebon zit er ook bij.
SPECIFICATIONS
CL(IDD) :11 cycles
Row Cycle Time (tRCmin) : 48.125ns (min.)
Refresh to Active/Refresh Command Time (tRFCmin) : 260ns (min.)
Row Active Time (tRASmin) : 35ns (min.)
Maximum Operating Power : 2.160 W* (per module)
UL Rating : 94 V - 0
Operating Temperature : 0C to 85C
Storage Temperature : -55C to +100C
- Power will vary depending on the SDRAM used.
DESCRIPTION
Kingston's KHX26C11T2K2/8X is a kit of two 512M x 64-bit (4GB) DDR3-2666 CL11 SDRAM (Synchronous DRAM), 1Rx8 memory modules, based on eight 512M x 8-bit FBGA compo- nents per module. Each module kit supports Intel® XMP (Extreme Memory Profiles). Total kit capacity is 8GB. Each module kit has been tested to run at DDR3-2666 at a low latency timing of 11-13-13 at 1.65V. The SPDs are pro- grammed to JEDEC standard latency DDR3-1600 timing of 11-11-11 at 1.5V. Each 240-pin DIMM uses gold contact fingers. The JEDEC standard electrical and mechanical specifi- cations are as follows:
XMP TIMING PARAMETERS
JEDEC: DDR3-1600 CL11-11-11 @1.5V
XMPProfile#1:D3-2666CL11-13-13@1.65V
XMPProfile#2:D3-2400CL11-13-13@1.65V
FEATURES
JEDECstandard1.5V(1.425V~1.575V)PowerSupply VDDQ=1.5V(1.425V~1.575V)
800MHzfCKfor1600Mb/sec/pin
8 independent internal bank
ProgrammableCASLatency:11,10,9,8,7,6
ProgrammableAdditiveLatency:0,CL-2,orCL-1clock 8-bit pre-fetch
Burst Length: 8 (Interleave without any limit, sequential with starting address 000 only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
Bi-directional Differential Data Strobe
Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
OnDieTerminationusingODTpin
Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C
Asynchronous Reset
PCB : Height 2.122 (53.90mm) w/ heatsink, single sided component